This 2014 Datacon Datacon 2200 EVO is a die cutter — a machine used in precision cutting applications to stamp, trim, or singulate components from sheet or panel materials using a shaped die. In the semiconductor and electronics packaging industries, die cutters of this type are also referred to as die bonders in certain process contexts, and Datacon is a well-regarded manufacturer of high-precision die-attach and die-handling equipment serving the microelectronics and optoelectronics sectors.
The seller describes this unit as a Generation 2 (Gen2) variant and notes that configuration is available as required, suggesting the machine can be set up to meet specific application or process needs. Installation service is also offered by the seller.
The listing is offered in used condition, having been manufactured in 2014. No further technical specifications, such as placement rate, bond force, stage dimensions, or supported substrate formats, are detailed in the available information.
This description was generated automatically from the listing details and may not reflect every specification. Please confirm with the seller before purchase.