The Datacon 2200 EVO is a used die cutter, also referred to as a die bonder, a precision machine used in semiconductor and microelectronics manufacturing to place and bond bare dies onto substrates, leadframes, or other carrier materials. Datacon is a well-established name in the advanced packaging and assembly equipment sector, building high-accuracy die bonding and placement systems for the electronics and semiconductor industries.
This particular machine is a Generation 1, single-head configuration, manufactured in 2011 and offered in used condition. The single-head setup is suited to applications where dedicated, sequential die placement is required. Installation services are noted as available, and the seller states that configuration can be arranged to meet specific requirements.
Beyond the generation and head configuration, detailed technical specifications such as placement speed, accuracy, substrate handling range, and supported die sizes are not provided in the listing, so buyers are encouraged to verify these particulars directly before proceeding.
This description was generated automatically from the listing details and may not reflect every specification. Please confirm with the seller before purchase.